Ray

6/9/2014
Lubbock, TX

Position Desired

Electronics Engineering
Anywhere in the U.S.
Yes

Resume

5 years of R&D experience on nano-materials synthesis, characterization and application. 2 years of experience on thin film supercapacitor. 1 year of experience on lithography in industrial environment and extensive knowledge in FEOL. 1 year of experience on CVD thin film growth. Published 11 journal papers, 1 patent and 2 conference presentations. Available immediately. Open to relocate.

Qualifications:
Expert on lithography theory and practices: OPC, PSM, Prolith, I-line, UV, DUV, immersion lithography, double patterning, image based OVL, diffraction based OVL.
Proven records in operating lithography equipment (ASML/Cannon scanners), trackers (TEL), overlay (KLA-Tencor), CD-SEMs (Hitachi), ellipsometer, defects scanning equipment (optical/SEM).
Extensive experience on thin film tools: Seki AX5200M PECVD, sputter coating, thermal evaporation, ion milling.
Solid knowledge of FEOL: lithography, plasma etch, PECVD, PVD, CMP.
Extensive experiences in operation and maintenance of the non-destructive characterization tools: SEM (SE/BSE/EDAX, Hitachi 570/2000/4300/4700), AFM, FTIR, XRD, and Raman.
Hand on skills on electrical characterization: Keithley, LabView, electrochemical workstation.
Closely involved in Operation simulation, Linear optimization, SPC, DOE, Minitab.

PROFESSIONAL EXPERIENCE:
Senior Associate Process Engineer (Lithography). 2009- 2010. SMIC, Shanghai, China.
Managed 5 major logical chips’ lithographic processes in high volume manufacturing.
Established the lithography parameters on 3 new products.
Trained 1 process engineer on entire lithography flow.
Built over 150 CD-SEM and overlay recipes; conducted over 10 FEM experiments and data analysis.
Monitored the manufacturing with SPC tools, solved problematic process by root cause analysis and maintained the Cpk at 1.67.
Inspected the photo resists quality continuously between different batches.
Cooperated with TD and PIE to develop new process; assisted Etch engineers inspecting the post-etch CD to refine the process.

Graduate Research Project Leader. 2010-2014. Advanced Materials Lab, Dept of I.E., TTU, TX.
Trained 3 graduate students on using SEM, EDAX and PVD.
Constructed v...

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